ApplicationsSoldering: Masking gold fingers or other sensitive areas during the soldering process. Especially useful where excessive heat is applied (for example: multiple immersions or long preheats during wave soldering) or if tape is to be left on the pcb after processing. Some low-solids fluxes require higher temperature preheats. We recommend INT 701 if this is the case. Temporary fixturing during soldering.
HAL: Hot air levelling.
Others: Hot dip galvanising, plasma spraying, annealing, wire insulation for extreme environments, e.g. aerospace.