CHOBOND 1038 is designed for use as a fillet, gap filler and seam sealant on electrical enclosures for EMI shielding or electrical grounding.
- One component - Easy to use, no weighing or mixing required.
- Silver plated copper filler - Excellent conductivity 0.010 ohm-cm
- Moisture cure silicone - 30 minute working life, rapid skin formation, 24 hr handling time, requires no pressure during curing, wide range of application temperatures. 1 week for full cure.
- Non corrosive cure mechanism
- Medium paste
- Easy to dispense, apply and spread, can be used on overhead or vertical surfaces.