Cho-Bond 1075 Electrically Conductive Sealant
CHO-BOND 1075 is a silver-plated, conductive silicone compound filled with aluminum, formulated for use as a fillet, gap filler, and seam sealant on electrical enclosures to provide EMI shielding and electrical grounding. For optimal results, CHO-BOND 1035 is recommended for use with CHO-SHIELD 1086 primer. CHO-BOND 1086 primer is an air-drying liquid coating used to improve the adhesion of conductive silicone compounds to metal and other non-silicone substrates.
Data Sheets
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CHO-BOND 1075 has a minimum recommended bond line of 0.010 inches. It is suitable for EMI gasket repair, bonding, and attachment in applications requiring moderate strength (100 psi). The silver-aluminium filler enhances galvanic corrosion resistance, particularly when applied to aluminium substrates.
Free of volatile organic compounds (VOCs) and exhibiting minimal shrinkage during curing, CHO-BOND 1075 is well-suited for both commercial and military applications. It's moisture-cure silicone polymer system cures to the touch within 24 hours and delivers a durable conductive and environmental seal across a wide range of operating temperatures.
Typical applications include man-portable electronics, radar and communication systems, EMI vents, military ground vehicles, and shelters. CHO-BOND 1075 should be used in conjunction with CHO-SHIELD 1086 primer (supplied in this kit) for best adhesion results. CHO-BOND 1086 is moisture reactive and clear in colour.
Shipping information
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