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Cho-Bond 1075/1086 Electrically Conductive Sealant
Cho-Bond 1075/1086 Electrically Conductive Sealant
Code produit: VAR0000520
De €175.73

CHO-BOND 1075 is a silver-plated, conductive silicone compound filled with aluminum, formulated for use as a fillet, gap filler, and seam sealant on electrical enclosures to provide EMI shielding and electrical grounding. For optimal results, CHO-BOND 1035 is recommended for use with CHO-SHIELD 1086 primer. CHO-BOND 1086 primer is an air-drying liquid coating used to improve the adhesion of conductive silicone compounds to metal and other non-silicone substrates.

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Cho-Bond 1075/1086 Electrically Conductive Sealant

Silmid P/N: VAR0000520
Cho-Bond 1075/1086 Electrically Conductive Sealant
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De €175.73 (hors TVA) €210.88 (TVA comprise)
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CHO-BOND 1075 is a silver-plated, conductive silicone compound filled with aluminum, formulated for use as a fillet, gap filler, and seam sealant on electrical enclosures to provide EMI shielding and electrical grounding. For optimal results, CHO-BOND 1035 is recommended for use with CHO-SHIELD 1086 primer. CHO-BOND 1086 primer is an air-drying liquid coating used to improve the adhesion of conductive silicone compounds to metal and other non-silicone substrates.

Data Sheets

Téléchargez dès aujourd'hui la fiche technique (TDS) du produit Cho-Bond 1075/1086 Electrically Conductive Sealant ainsi que la fiche de données de sécurité (SDS) du produit Cho-Bond 1075/1086 Electrically Conductive Sealant sur Silmid. Une fois que vous vous êtes connecté(e) ou inscrit(e), sélectionnez la taille du produit qui vous intéresse et la fiche technique sera disponible en téléchargement.

Informations produits

CHO-BOND 1075 has a minimum recommended bond line of 0.010 inches. It is suitable for EMI gasket repair, bonding, and attachment in applications requiring moderate strength (100 psi). The silver-aluminium filler enhances galvanic corrosion resistance, particularly when applied to aluminium substrates.

Free of volatile organic compounds (VOCs) and exhibiting minimal shrinkage during curing, CHO-BOND 1075 is well-suited for both commercial and military applications. It's moisture-cure silicone polymer system cures to the touch within 24 hours and delivers a durable conductive and environmental seal across a wide range of operating temperatures.

Typical applications include man-portable electronics, radar and communication systems, EMI vents, military ground vehicles, and shelters. CHO-BOND 1075 should be used in conjunction with CHO-SHIELD 1086 primer (supplied in this kit) for best adhesion results. CHO-BOND 1086 is moisture reactive and clear in colour.

Shipping information

Livraison internationale (livraison de porte à porte) estdisponible pour certains pays dans le monde entier.Livraison sera automatiquement calculé sur le poids,l’emplacement et la nature dangereuse des marchandises.Les clients peuvent également choisir à l’usine d’organiserleur propre collection. 

Veuillez vous reporter à notre page de livraison pour plusd’informations.