Cho-Bond 1035/1086 Electrically Conductive Silicone Sealant
Product notice - To mitigate supply chain issues, this product has been reformulated. The new product is chemically and functionally similar but should be tested prior to use. Click here to learn more.
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- Minimum recommended bond line for CHO-BOND 1035 is 0.007 inches (0.18 mm)
- The lightweight silver glass filler provides a low cost EMI shielding solution for a variety of commercial and military applications, including applications where weight savings are critical
- Cho-Bond 1035 moistures cure silicone polymer system allows it to cure to the touch in 24 hours
- Provides a flexible, conductive and environmental seal over a wide range of application temperatures
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