Features of Cho Bond 1030/1086:
- Moisture reactive and clear in colour
- Easy to use, no weighing or mixing required.
- Silver plated copper filler
- Good conductivity 0.050 ohm-cm.
- No VOCs • Minimal shrinkage.
- Moisture cure silicone
CHO-BOND 1086 primer is formulated for use with CHO-BOND 1016,1030, 1035, 1038, 1075 electrically conductive adhesives/sealants and CHOTHERM® 1641 thermal compound.