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HexBond™ 319 Modified Epoxy Film Adhesive

Silmid P/N: VAR0001371
HexBond 319  is a high performance modified epoxy film adhesive curing at 175°C. It is available in both supported and unsupported versions at areal weights between 180 and 400 g/m2.

Technical Information

  • Commodity Code 39209928
  • Country of Origin United Kingdom

Informations produits

HexBond 319  is a high performance modified epoxy film adhesive curing at 175°C. It is available in both supported and unsupported versions at areal weights between 180 and 400 g/m2. The supported versions contain a woven nylon carrier for glueline thickness control and improved handleability. HexBond 319 is a hot melt film which is free from solvents and consequently it has a very low volatile content.

Features

  • Cures in 60 minutes at 175°C
  • Good performance at temperatures ranging from -55°C to 150°C
  • Good short-term exposure performance at 175°C
  • Excellent peel properties
  • Good drape at ambient temperatures
  • Less than 1% volatile content

Applications

  • Aluminium to aluminium bonding
  • Fibre-reinforced composite to composite bonding
  • Aluminium honeycomb sandwich bonding
  • Aramid honeycomb sandwich bonding

Details:

  • HexBond™ 319
  • High Performance Modified Epoxy Film Adhesive
  • 367gsm
  • Various sizes available
  • (Freezer Storage -18°C)

**Please note, we recommend the use of dry ice for transportationclick hereto add dry ice to your basket**

Shipping information

Livraison internationale (livraison de porte à porte) estdisponible pour certains pays dans le monde entier.Livraison sera automatiquement calculé sur le poids,l’emplacement et la nature dangereuse des marchandises.Les clients peuvent également choisir à l’usine d’organiserleur propre collection. 

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