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Epotek H20S Adhesive 1oz Kit

EPH20S01OZ
Epotek H20S Adhesive 1oz Kit
Epotek H20S Adhesive is a modified version of Epotek H20E designed primarily for die stamping and dispensing techniques for chip bonding, a highly reliable two component silver filled epoxy with a smooth thixotropic consistency
Code UN: UN3082 CL9 III
Quantité limitée: 5L

Features

  • High electrical conductivity
  • Short curing cycles
  • Especially recommended for use in high speed epoxy chip bonding systems where fast cures are highly desirable
  • Suggested for JEDEC level lll and ll plastic IC packaging
  • Low temperature cure makes it ideal for flex circuity and other low stress applications
  • Used extensively for bonding quartz crystal oscillators and other stress sensitive chips
  • Used for die and SMD bonding inside hybrid/hermetic packages such as DIP and To-Cans also EMI/Rf shielding of micro-electronics

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