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EPO-TEK® 353ND A/B High Temperature Epoxy Adhesive
EPO-TEK® 353ND A/B High Temperature Epoxy Adhesive
Code produit: VAR0002079
De €16.04

EPO-TEK 353ND is a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. It is one of the most popular EPO-TEK brand products, and is known throughout the world for its performance and reliability

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EPO-TEK® 353ND A/B High Temperature Epoxy Adhesive 1Lb Kit

Silmid P/N: EP353ND1LB
EPO-TEK® 353ND A/B High Temperature Epoxy Adhesive 1Lb Kit
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€252.50 (hors TVA) €303.00 (TVA comprise)
Pas de stock - Délai de livraison standard 61 jours ouvrables
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EPO-TEK 353ND is a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. It is one of the most popular EPO-TEK brand products, and is known throughout the world for its performance and reliability

Technical Information

  • Code UN 3082 CL9 / 3267 CL8
  • Code des marchandises 39073000
  • Pays d'origine United States
UNIQUEMENT POUR LE ROYAUME-UNI : Des restrictions à l'exportation s'appliquent à ce produit. Si vous souhaitez expédier ce produit en dehors du Royaume-Uni, veuillez contacter votre gestionnaire de compte ou nous appeler au +44 (0)1675 432850.

Data Sheets

Téléchargez dès aujourd'hui la fiche technique (TDS) du produit EPO-TEK® 353ND A/B High Temperature Epoxy Adhesive 1Lb Kit ainsi que la fiche de données de sécurité (SDS) du produit EPO-TEK® 353ND A/B High Temperature Epoxy Adhesive 1Lb Kit depuis Silmid. Une fois que vous vous êtes connecté(e) ou inscrit(e), la fiche technique sera visible et téléchargeable.

Informations produits

Epo-tek 353ND Advantages Application Notes:

  • Reasonable pot-life that allows for low temperature curing to be realized. It has an amber color change upon cure.
  • NASA approved, low outgassing epoxy - http://outgassing.nasa.gov/
  • Semiconductor suggested applications: wafer-wafer bonding of CSP; fabrication of MEMs devices; flip chip underfill.
  • Hybrid suggested applications: providing near hermetic seals in sensor devices, resisting high temperature packaging o Down-Hole petrochemical fiber optic sensors, resisting >200°C field conditions
  • Fiber optic adhesive designed to meet Telecordia 1221 - suggested applications: o Sealing fiber into ferrules, transmitting light in the optical pathway from 800- 1550 nm range o Fiber component packaging; adhesive for active alignment of optics, environmental seal of opto-package, V-groove arrays

Medical suggested applications:

  • Potting Fiber Optic bundles into SST ferrules for light guides and endoscopes, resisting sterilization cycles of autoclave, ETO, gamma, H202 plasma
  • Certified to USP Class VI Biocompatiblility Standards for medical implants; adhesive for catheter devices including stents and guide wires

Electronics Assembly suggested Applications:

  • Used as dielectric layer in the fabrication of capacitors; laminating PZT ferroelectrics found in ultrasound or ink-jetting devices
  • Impregnating and insulating copper coil windings in motors and inductor coils. Bonding ferrite cores and

Shipping information

Livraison internationale (livraison de porte à porte) estdisponible pour certains pays dans le monde entier.Livraison sera automatiquement calculé sur le poids,l’emplacement et la nature dangereuse des marchandises.Les clients peuvent également choisir à l’usine d’organiserleur propre collection. 

Veuillez vous reporter à notre page de livraison pour plusd’informations.