DOWSIL™ 340 Heat Sink Compound
Dowsil 340 Heat Sink Compound is a non-curing and non-flowing thermally conductive compound.
Data Sheets
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The product is specifically designed to provide long-term bonding and to protect against moisture, environmental attack, mechanical and thermal shock as well as vibration especially where a high-strength product is required. Its typical applications include bonding of sensitive electronic components and sub-assemblies.
Features:
- one part
- Non-sag
- Room temperature cure
- Neutral alkoxy cure system
- Excellent adhesion to glass, ceramics, metals, silicone rubber and many plastics
- High tear strength flexible rubber - protects against mechanical shock and thermal cycling stress at components
- Stable and flexible from -50°C to +200°C
- Excellent dielectric properties
- Non-corrosive
- Aerospace standard
Shipping information
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