Cho-Bond 4660 Electrically Conductive Sealant
CHO-BOND 4660 is a one-component, silver plated, conductive polyisobutylene compound filled with copper, formulated for use as a fillet, gap filler, and seam sealant on electrical enclosures to provide EMI shielding and electrical grounding.
Data Sheets
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CHO-BOND 4660 is non-hardening, making it especially well-suited for shielding joints and seams that may require disassembly, as well as applications requiring resistance to vibration and thermal shock. A minimum bond line of 0.015 inches is recommended. It becomes dry to the touch within minutes and achieves full material properties after 168 hours. The compound remains permanently flexible and adherent, with no tendency to crack or separate from the substrate. While some surface crusting may occur, the material stays pliable beneath the surface.
The product is easy to dispense with a standard caulking gun and can be applied to both overhead and vertical surfaces. Typical applications include access panels, shielded room joints, temporary military shelters, hardware, bulkhead feed through fittings, and building conduits. Additionally, CHO-BOND 4660 can assist in gas sealing, as its polyisobutylene polymer system provides excellent impermeability.
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