Cho-Bond 1038/1086 Electrically Conductive Silicone Sealant
CHO-BOND 1038 is a silver-plated, copper-filled, one-component conductive silicone designed for use as a fillet, gap filler and seam sealant on electrical enclosures for EMI shielding or electrical grounding. For optimal results, CHO-BOND 1035 is recommended for use with CHO-SHIELD 1086 primer. CHO-BOND 1086 primer is an air-drying liquid coating used to improve the adhesion of conductive silicone compounds to metal and other non-silicone substrates.
Data Sheets
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CHO-BOND 1038 has a minimum recommended bond line of 0.007 inches. This product may be used for EMI gasket repair, bonding, and attachment in applications where moderate strength (less than 150 psi) is required. The moisture cure silicone polymer system allows it to cure to the touch in 24 hours and provides a robust conductive and environmental seal over a wide range of application temperatures. It offers minimal shrinkage, requires no permits or ventilation, and generates no corrosive by-products during curing to damage the substrate. Typical applications include man portable electronics, radar and communication systems, EMI vents, military ground vehicles, and shelters.
CHO-BOND 1038 should be used in conjunction with CHO-SHIELD 1086 primer (supplied in this kit) for best adhesion results. CHO-BOND 1086 is moisture reactive and clear in colour.
Shipping information
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