Mereco XL-389T Thermally Conductive Epoxy Potting & Encapsulating Compound
Mereco XL-389T is a Thermally Conductive Epoxy Potting & Encapsulating Compound
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Mereco XL-389 FRLV is a new, flexible, low viscosity thermally conductive epoxy potting and encapsulating compound which will pass UL-94V0 requirements and has been specifically designed for potting transformers and power supplies where minimal change in inductance after potting is required.
XL-389 FRLV has found extensive use in potting state of the art power components such as AC Input products, DC Input products, attenuator modules, module evaluation boards, military power components, as well as conventional power supplies. XL-389 FRLV's low viscosity allows it to penetrate difficult to pot areas.
Details:
- Mereco XL-389T
- Thermally Conductive Epoxy Potting & Encapsulating Compound
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