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Epotek H61 Thermally Conductive Epoxy 3oz Kit

EPOH61E3OZ
Epotek H61 Thermally Conductive Epoxy 3oz Kit
EPO-TEK® H61 is a single component, thermally conductive, electrically insulating, epoxy adhesive for semiconductor, hybrid IC, and electronic circuit assembly applications.
Número ONU: UN3082 CL9 III
Cantidad limitada: 5L

Features

  • It is a thixotropic paste and a non-sagging adhesive. It is also useful for deposition methods like dispensing, printing, or hand held processes.

Suggested Applications

  • Hybrid
  • Staking SMDs onto the PCB for extra mechanical support; insulation layer between 2 contact pads of caps and resistors.
  • Heat sinking devices on ceramic PCB and PCB to external case; adhesion to Si, Au, kovar, Al-N, BT.
  • Reinforcing and extra mechanical support for wire bond integrity.
  • Electronics
  • Bonding passive devices such as inductor coils, ferrites, motors, connectors, and various SMDs.
  • Adhesion to FR4 and common PCB substrates and housings

 

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