Epotek H61 Thermally Conductive Epoxy 3oz Kit
EPOH61E3OZ
EPO-TEK® H61 is a single component, thermally conductive, electrically insulating, epoxy adhesive for semiconductor, hybrid IC, and electronic circuit assembly applications.
Número ONU: UN3082 CL9 III
Cantidad limitada: 5L
Features
- It is a thixotropic paste and a non-sagging adhesive. It is also useful for deposition methods like dispensing, printing, or hand held processes.
Suggested Applications
- Hybrid
- Staking SMDs onto the PCB for extra mechanical support; insulation layer between 2 contact pads of caps and resistors.
- Heat sinking devices on ceramic PCB and PCB to external case; adhesion to Si, Au, kovar, Al-N, BT.
- Reinforcing and extra mechanical support for wire bond integrity.
- Electronics
- Bonding passive devices such as inductor coils, ferrites, motors, connectors, and various SMDs.
- Adhesion to FR4 and common PCB substrates and housings
Entrega internacional (entrega puerta a puerta) está disponible para países seleccionados en todo el mundo. Envío se calculan automáticamente basado en el peso, la ubicación y la naturaleza peligrosa de las mercancías. Los clientes también pueden elegir fábrica para arreglar su propia colección.
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