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CHO-BOND 360 compound is an electrically conductive epoxy adhesive that combines the good characteristics of epoxy, and the superior electrical conductivity of silver.

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€343.32+ IVA
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Cho-Bond 360-20 Electrically Conductive Epoxy Adhesive 1Lb Kit *BMS 5-35 Type I Grade B

Silmid P/N: CH360201LB
€361.40 (IVA no incl.) €433.68 (IVA incl.)
No hay existencias - Plazo de entrega estándar 52 días laborables
Por favor ordene en múltiplos de 3
Descuentos por volumen
3+
€361.40+ IVA
6+
€343.32+ IVA
12+
€334.29+ IVA
24+
€325.26+ IVA

CHO-BOND 360 compound is an electrically conductive epoxy adhesive that combines the good characteristics of epoxy, and the superior electrical conductivity of silver.

Technical Information

  • Código del producto 74061000
  • País de Origen United States

Data Sheets

Descarga hoy mismo la hoja técnica (TDS) del producto Cho-Bond 360-20 Electrically Conductive Epoxy Adhesive 1Lb Kit y la hoja de datos de seguridad (SDS) del producto Cho-Bond 360-20 Electrically Conductive Epoxy Adhesive 1Lb Kit desde Silmid. Una vez que hayas iniciado sesión o te hayas registrado, la hoja de datos será visible para su descarga.

Información del producto

It is recommended as a thermo-setting EMI/RFI shielding compound and is excellent for poorly toleranced, non-flat surfaces which have been coated with a thin dielectric layer. Its coarse granular silver-plated copper filler will abrade thin oxides from aluminium, copper and galvanised steel, especially when applied between flanges under modest contact pressure.

Applications typically include sealing EMI/RFI leaks around vents, windows, and machined surfaces; the bonding, environmental sealing, and EMI shielding of cast aluminium housings; the bonding and shielding of conduit bulkhead passthroughs.

This product has excellent adhesion to dissimilar substrates. Because of its excellent adhesive properties, it should not be used if it is anticipated that the seam will be ‘broken' at a future date.

CHO-BOND 360-20 conductive adhesive is the lowest cost variant of CHO-BOND 360, easiest to mix with a 1:1 mix ratio, is most conductive, has the highest lap shear bond strength, may be room-temperature cured, fills large gaps, and has good thermal shock resistance. It has a one-hour pot life.

Shipping information

Entrega internacional (entrega puerta a puerta) está disponible para países seleccionados en todo el mundo. Envío se calculan automáticamente basado en el peso, la ubicación y la naturaleza peligrosa de las mercancías. Los clientes también pueden elegir fábrica para arreglar su propia colección.