Cho-Bond 1038/1086 Electrically Conductive Silicone Sealant
CHO-BOND 1038 is a silver-plated, copper-filled, one-component conductive silicone designed for use as a fillet, gap filler and seam sealant on electrical enclosures for EMI shielding or electrical grounding.
Data Sheets
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The minimum recommended bond line for CHO-BOND 1038 is 0.007 inches (0.18mm). In addition, CHO-BOND 1038 may be used for EMI gasket repair, bonding, and attachment in applications where moderate strength (less than 150 psi) is required. CHO-BOND 1038's moisture cure silicone polymer system allows it to cure to the touch in 24 hours and provides a robust conductive and environmental seal over a wide range of application temperatures.
Its non-corrosive cure mechanism prevents the generation of corrosive by-products during curing to damage substrates.
CHO-BOND 1038 should be used in conjunction with CHOSHIELD 1086 primer (supplied in this kit) for best adhesion results. Typical applications include man portable electronics, radar and communication systems, EMI vents, military ground vehicles, and shelters.
Shipping information
Entrega internacional (entrega puerta a puerta) está disponible para países seleccionados en todo el mundo. Envío se calculan automáticamente basado en el peso, la ubicación y la naturaleza peligrosa de las mercancías. Los clientes también pueden elegir fábrica para arreglar su propia colección.