Cho-Bond 584-29 Epoxy Adhesive
CHO-BOND 584-29 is a two-component, silver-filled, conductive epoxy adhesive system designed for applications where a strong, highly conductive electrical bond must be achieved.
Data Sheets
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CHO-BOND 584-29 is recommended for relatively small bond lines (less than 0.010 inches (0.25mm)) but can be used for larger bond lines in applications where vibration or potential for cracking is not an issue. With low VOCs and minimal shrinkage, CHO-BOND 584-29 is a good choice for a range of applications.
The fine silver filler of CHO-BOND 584-29 makes it a good material choice for precise application in and around tight spaces and electrical components. CHO-BOND 584-29 comes in a variety of sizes and packaging so customers can choose a package and material size which is right for their application, minimizing material scrap and mixing issues.
Curing of CHO-BOND 584-29 can be achieved in as little as 15 minutes with heat to minimize equipment downtime and increase manufacturing throughput. Typical applications include bonding and grounding of electrical components, cold soldering, and bonding and sealing machined enclosures.
Shipping information
Entrega internacional (entrega puerta a puerta) está disponible para países seleccionados en todo el mundo. Envío se calculan automáticamente basado en el peso, la ubicación y la naturaleza peligrosa de las mercancías. Los clientes también pueden elegir fábrica para arreglar su propia colección.