Cho-Bond 4669 Electrically Conductive Sealant
CHO-BOND 4669 is a silver-plated, copper-filled, one-component conductive polyisobutylene designed for use as a fillet, gap filler and seam sealant on electrical enclosures for EMI shielding or electrical grounding.
Data Sheets
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CHO-BOND 4669 has an extended two-hour working life, longer than the similar CHO-BOND 4660. It has a minimum recommended bond line of 0.015 inches and its non-hardening characteristic makes it particularly suited for shielding joints and seams likely to be disassembled or used in applications requiring vibration and thermal shock resilience. The compound remains permanently flexible and adherent, with no tendency to crack or separate from the substrate. While some surface crusting may occur, the material stays pliable beneath the surface.
CHO-BOND 4669 is easy to dispense with a standard caulking gun and can be applied to both overhead and vertical surfaces. Typical applications include access panels, shielded room joints, temporary military shelters, hardware, bulkhead feed through fittings, and building conduits. Additionally, CHO-BOND 4669 can assist in gas sealing, as its polyisobutylene polymer system provides excellent impermeability.
Shipping information
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