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Epotek H20E Adhesive 1oz Kit

EPOH20E1OZ
Epotek H20E Adhesive 1oz Kit
EPO-TEK® H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications.
Número ONU: UN3082 CL9 III
Cantidad limitada: 5L

Advantages & Application Notes

  • Especially recommended for use in high speed epoxy chip bonding systems where very fast cures are desired.
  • Suggested for JEDEC Level III and II for plastic IC packaging.
  • NASA approved and is NON TOXIC—complying with USP Class VI Biocompatibility Standards.
  • Capable of resisting TC wire bonding temperatures in the range of 300°C to 400°C.
  • Ease of use; apply by dispensing, screen printing, die-stamping, or by hand.
  • Especially suited for high power devices and high current flow. High power LEDs.
  • Opto-electronic packaging material: LED, LCDs, and fiber optic components.

Entrega internacional (entrega puerta a puerta) está disponible para países seleccionados en todo el mundo. Envío se calculan automáticamente basado en el peso, la ubicación y la naturaleza peligrosa de las mercancías. Los clientes también pueden elegir fábrica para arreglar su propia colección.