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CHO-BOND 360-20 compound is an electrically conductive epoxy adhesive that combines the good characteristics of epoxy, and the superior electrical conductivity of silver.

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€395.09+ IVA
8+
€375.34+ IVA
16+
€365.45+ IVA
32+
€355.58+ IVA
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Cho-Bond 360-20 Electrically Conductive Epoxy Adhesive 1Lb Kit *BMS 5-35F Type I Grade B

Silmid P/N: P0250517
€395.09 (IVA no incl.) €474.11 (IVA incl.)
No hay existencias - Plazo de entrega estándar 75 días laborables
Por favor ordene en múltiplos de 4
Descuentos por volumen
4+
€395.09+ IVA
8+
€375.34+ IVA
16+
€365.45+ IVA
32+
€355.58+ IVA

CHO-BOND 360-20 compound is an electrically conductive epoxy adhesive that combines the good characteristics of epoxy, and the superior electrical conductivity of silver.

Technical Information

  • Código del producto 35061000
  • País de Origen United States

Data Sheets

Descarga hoy mismo la hoja técnica (TDS) del producto Cho-Bond 360-208 y la hoja de datos de seguridad (SDS) del producto Cho-Bond 360-208 desde Silmid. Una vez que hayas iniciado sesión o te hayas registrado, la hoja de datos será visible para su descarga.

Product Properties

Pack Size
1Lb Kit
Product Colour
Grey | Silver
Brand
Chomerics Cho-Bond
Manufacturer Name
Parker Hannifin Corporation

Specifications

Boeing
BMS 5-35 Type I Grade B

spec_table_disclaimer

Información del producto

CHO-BOND 360 is recommended as a thermo-setting EMI/RFI shielding compound. It is excellent for poorly tolerance, non-flat surfaces coated with a thin dielectric layer, and it's coarse granular silver-plated copper filler abrades thin oxides from aluminum, copper, and galvanised steel, especially when applied between flanges under modest contact pressure. Applications typically include sealing EMI/RFI leaks around vents, windows, and machined surfaces; the bonding, environmental sealing, and EMI shielding of cast aluminum housings; the bonding and shielding of conduit bulkhead passthroughs. This product has excellent adhesion to dissimilar substrates, but due to its strong bonding properties, it should not be used where the seam may need to be broken in the future.

CHO-BOND 360-20 conductive adhesive is the lowest-cost variant of CHO-BOND 360. It is easy to mix with a 1:1 ratio, offers the highest conductivity and lap shear bond strength and cures at room temperature. The adhesive fills large gaps, provides good thermal shock resistance and has a one-hour pot life.

Shipping information

Entrega internacional (entrega puerta a puerta) está disponible para países seleccionados en todo el mundo. Envío se calculan automáticamente basado en el peso, la ubicación y la naturaleza peligrosa de las mercancías. Los clientes también pueden elegir fábrica para arreglar su propia colección.