Mereco XL-389T Thermally Conductive Epoxy Potting & Encapsulating Compound
Mereco XL-389T is a Thermally Conductive Epoxy Potting & Encapsulating Compound
Data Sheets
Download the Mereco XL-389T Thermally Conductive Epoxy Potting & Encapsulating Compound technical data sheet (TDS) and the Mereco XL-389T Thermally Conductive Epoxy Potting & Encapsulating Compound safety data sheet (SDS) from Silmid today. Once you have logged in or signed up, select the product size you are interested in and the datasheet will be visible for download if one is available. Please login and select to access DatasheetsProduct Information
Mereco XL-389 FRLV is a new, flexible, low viscosity thermally conductive epoxy potting and encapsulating compound which will pass UL-94V0 requirements and has been specifically designed for potting transformers and power supplies where minimal change in inductance after potting is required.
XL-389 FRLV has found extensive use in potting state of the art power components such as AC Input products, DC Input products, attenuator modules, module evaluation boards, military power components, as well as conventional power supplies. XL-389 FRLV's low viscosity allows it to penetrate difficult to pot areas.
Details:
- Mereco XL-389T
- Thermally Conductive Epoxy Potting & Encapsulating Compound
Shipping information
International delivery (door to door delivery) is available for selected countries worldwide. Shipping will be automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection.
Please refer to our delivery page for more information.