EPO-TEK® H74 A/B Thermally Conductive Epoxy Adhesive 3oz Kit
EPO-TEK H74 A/B is a Thermally Conductive Epoxy Adhesive in a 3oz Kit.
Technical Information
- UN Number 3267 CL8
- Commodity Code 39073000
- Country of Origin United States
Data Sheets
Download the EPO-TEK® H74 A/B Thermally Conductive Epoxy Adhesive 3oz Kit technical data sheet (TDS) and the EPO-TEK® H74 A/B Thermally Conductive Epoxy Adhesive 3oz Kit safety data sheet (SDS) from Silmid today. Once you have logged in or signed up, the datasheet will be visible for download if one is available. Please login to access DatasheetsProduct Information
This two component , thermally conductive epoxy designed for hybrid circuit assembly including die attach, substrate attach, lid seal, heat dissipation, and hermetic sealing in general.
Shipping information
International delivery (door to door delivery) is available for selected countries worldwide. Shipping will be automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection.
Please refer to our delivery page for more information.