EPO-TEK® H61 Thermally Conductive Epoxy Adhesive 3oz Pack (Fridge Storage)
EPO-TEK H61 is a single component, thermally conductive, electrically insulating, epoxy adhesive for semiconductor, hybrid IC, and electronic circuit assembly applications.
Technical Information
- Commodity Code 35069190
- Country of Origin United States
Data Sheets
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Product Information
It is a thixotropic paste and a non-sagging adhesive. It is also useful for deposition methods like dispensing, printing, or hand held processes.
Suggested Applications:
- Hybrid
- Staking SMDs onto the PCB for extra mechanical support; insulation layer between 2 contact pads of caps and resistors.
- Heat sinking devices on ceramic PCB and PCB to external case; adhesion to Si, Au, kovar, Al-N, BT.
- Reinforcing and extra mechanical support for wire bond integrity.
- Electronics
- Bonding passive devices such as inductor coils, ferrites, motors, connectors, and various SMDs.
- Adhesion to FR4 and common PCB substrates and housings
Shipping information
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**orders placed through the office will incur additional charges.**
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