Chipshield 2590 UV & Heat Cure Epoxy 3cc Syringe (Freezer Storage -18°C)
Chipshield 2590 is a very low viscosity, semi-rigid, low profile glob coating designed for low CTE and glob top/encapsulation applications.
Technical Information
- Commodity Code 35069190
Data Sheets
Download the Chipshield 2590 UV & Heat Cure Epoxy 3cc Syringe (Freezer Storage -18°C) technical data sheet (TDS) and the Chipshield 2590 UV & Heat Cure Epoxy 3cc Syringe (Freezer Storage -18°C) safety data sheet (SDS) from Silmid today. Once you have logged in or signed up, the datasheet will be visible for download if one is available. Please login to access DatasheetsProduct Information
Features:
- One component system
- Naturally opaque
- Increased productivity due to short cure times
- UV and Heat cure process for shadowed/deep section cure
- Very Low extractable ionic content
Shipping information
International delivery (door to door delivery) is available for selected countries worldwide. Shipping will be automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection.
Please refer to our delivery page for more information.