Key Features & Benefits
- Thermal conductivity - Dissipation of heat from bonded components
- Thixotropic paste - No flow or sag even on vertical surfaces
- Wide variety of catalysts available - Versatility of resin sustem
- Low coefficient of thermal expansion - Low stress on bonded components
ECCOBOND 285 is designed for bonding metals and ceramic substrates in heat sink applications or any application that requires a thermally conductive adhesive for thermal management. It is also useful for any application that requires a thixotropic paste adhesive and low stress bonds.