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Redux 319 High Performance Modified Epoxy Film Adhesive (367g/m2 Areal Weight) 5SqMt (Freezer Storage -18°C)

RE31905SQM
Redux 319 High Performance Modified Epoxy Film Adhesive (367g/m2 Areal Weight) 5SqMt (Freezer Storage -18°C)
Redux® 319 is a high performance modified epoxy film adhesive curing at 175°C. It is available in both supported and unsupported versions at areal weights between 180 and 400 g/m2. The supported versions contain a woven nylon carrier for glueline thickness control and improved handleability. Redux® 319 is a hot melt film which is free from solvents and consequently it has a very low volatile content.

Features

  • Cures in 60 minutes at 175°C
  • Good performance at temperatures ranging from -55°C to 150°C
  • Good short-term exposure performance at 175°C
  • Excellent peel properties
  • Good drape at ambient temperatures
  • Less than 1% volatile content

Applications

  • Aluminium to aluminium bonding
  • Fibre-reinforced composite to composite bonding
  • Aluminium honeycomb sandwich bonding
  • Aramid honeycomb sandwich bonding
**Please note, we recommend the use of dry ice for transportation click here to add dry ice to your basket**

Entrega internacional (entrega puerta a puerta) está disponible para países seleccionados en todo el mundo. Envío se calculan automáticamente basado en el peso, la ubicación y la naturaleza peligrosa de las mercancías. Los clientes también pueden elegir fábrica para arreglar su propia colección. 

Documentos
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