HexBond™ 319 Modified Epoxy Film Adhesive
HexBond 319 is a high performance modified epoxy film adhesive curing at 175°C. It is available in both supported and unsupported versions at areal weights between 180 and 400 g/m2.
Data Sheets
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HexBond 319 is a high performance modified epoxy film adhesive curing at 175°C. It is available in both supported and unsupported versions at areal weights between 180 and 400 g/m2. The supported versions contain a woven nylon carrier for glueline thickness control and improved handleability. HexBond 319 is a hot melt film which is free from solvents and consequently it has a very low volatile content.
Features:
- Cures in 60 minutes at 175°C
- Good performance at temperatures ranging from -55°C to 150°C
- Good short-term exposure performance at 175°C
- Excellent peel properties
- Good drape at ambient temperatures
- Less than 1% volatile content
Applications:
- Aluminium to aluminium bonding
- Fibre-reinforced composite to composite bonding
- Aluminium honeycomb sandwich bonding
- Aramid honeycomb sandwich bonding
Shipping information
Entrega internacional (entrega puerta a puerta) está disponible para países seleccionados en todo el mundo. Envío se calculan automáticamente basado en el peso, la ubicación y la naturaleza peligrosa de las mercancías. Los clientes también pueden elegir fábrica para arreglar su propia colección.