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Mereco XL-389T Thermally Conductive Epoxy Potting & Encapsulating Compound 1USP Kit

P1500463
Mereco XL-389T Thermally Conductive Epoxy Potting & Encapsulating Compound 1USP Kit
Mereco XL-389 FRLV is a new, flexible, low viscosity thermally conductive epoxy potting and encapsulating compound which will pass UL-94V0 requirements and has been specifically designed for potting transformers and power supplies where minimal change in inductance after potting is required.
€536.57 IVA no incl.
€643.88 IVA incl.
Sin stock - plazo de entrega 66 días
Por favor ordene en múltiplos de 2
Número ONU: UN2735 CL8 III
Cantidad limitada: 1L
Descuentos por volumen
2+
€536.57+ IVA
4+
€522.44+ IVA
8+
€508.33+ IVA

Features

XL-389 FRLV has found extensive use in potting state of the art power components such as AC Input products, DC Input products, attenuator modules, module evaluation boards, military power components, as well as conventional power supplies. XL-389 FRLV’s low viscosity allows it to penetrate difficult to pot areas

Entrega internacional (entrega puerta a puerta) está disponible para países seleccionados en todo el mundo. Envío se calculan automáticamente basado en el peso, la ubicación y la naturaleza peligrosa de las mercancías. Los clientes también pueden elegir fábrica para arreglar su propia colección.