Alpha OM-5100 (SN62/PB36/AG2) Leaded Fine Pitch Solder Paste 500gm Jar (Fridge Storage 0°C-10°C)
- Commodity Code 38101000
- Country of Origin Hungary
- UN Number 3077 CL9
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ALPHA OM-5100 Solder Paste is a low residue, no-clean solder paste designed to maximize first pass yields. The ALPHA OM-5100 activation system is optimized to enhance joint solderability and limit post reflow soldering defects. This paste's wide reflow profile window enables soldering with lead free components.
ALPHA OM-5100 is designed for complex assemblies with small (0201) tin finished passives and enables solderability with large (1mm pitch) BGA components containing lead free spheres. Small print deposits remain fully coalesced, even in profiles hot enough to collapse SAC305 BGA spheres.
Low flux residue volume supports underfill compatibility: Low residue enables high throughput underfill processing. Compatibility with leading underfills offers low underfill voiding and non-delamination to ensure highest mechanical strength of resulting assembly.
Consistent fine feature printability: Superior print volume repeatability down to .300 mm circles and .225mm deposits. ALPHA OM-5100 exhibits excellent print yields with no dog ears or slump on fine feature square deposits.
- Alpha OM-5100 (SN62/PB36/AG2)
- Leaded Fine Pitch Solder Paste
- 500gm Jar
- Fridge Storage 0°C-10°C
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