ECCOBOND 285 is a highly filled, thermally conductive, thixotropic, non-sag paste epoxy adhesive that can be used with a variety of catalysts.
£98.87 excl VAT
£118.64 inc VAT
No stock - lead time 31 days
UN Number: UN2810 CL6.1 III
Limited Quantity: 5L
£98.87 + VAT
£93.93 + VAT
£91.45 + VAT
£88.98 + VAT
Key Features & Benefits
- Thermal conductivity - Dissipation of heat from bonded components
- Thixotropic paste - No flow or sag even on vertical surfaces
- Wide variety of catalysts available - Versatility of resin sustem
- Low coefficient of thermal expansion - Low stress on bonded components
ECCOBOND 285 is designed for bonding metals and ceramic substrates in heat sink applications or any application that requires a thermally conductive adhesive for thermal management. It is also useful for any application that requires a thixotropic paste adhesive and low stress bonds.
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Orders under £50 placed online for UK Mainland delivery is £6.95*
Orders requiring Pre 10.00am Next Day delivery has also been lowered from £35.00 to £19.50**
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