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Cho-Bond 584-29 Epoxy Adhesive 2.5gm Bipack

CH5842925G
Cho-Bond 584-29 Epoxy Adhesive 2.5gm Bipack
£19.12 excl VAT
£22.94 inc VAT
No stock - lead time 24 days
UN Number: UN3082 CL9 & 2735 CL8 III/II
Limited Quantity: 5L
Qty
Please order in multiples of 12
Chomerics CHO-BOND® 584-29 is a two-component, highly conductive adhesive system that combines the strong adhesive characteristics of epoxy with the superior conductivity of pure silver. In addition to being available in bulk form, the material is now offered in the convenient pre-measured SYRINGE-PAK™ for rapid application.
Bulk discounts
12+
£19.12 + VAT
24+
£18.62 + VAT
48+
£18.12 + VAT

This new syringe system simplifies the mixing of resin and hardening components, and improves dispensing accuracy and  efficiency. The result is less compound waste and lower applied cost.

CHO-BOND 584-29 conductive adhesive has a low viscosity  allowing easier application through fine gauge needles. With  its silver filler, the compound provides a low volume resistivity of 0.002 ohm-cm when used as a highly conductive pathway in microelectronics, circuit repair, EMI shielding systems, ground paths, and other applications. The adhesive cures at room  temperature in 24 hours.

Orders over £50 placed online will now qualify for FREE UK Mainland delivery*

Orders under £50 placed online for UK Mainland delivery is £6.95*

Orders requiring Pre 10.00am Next Day delivery has also been lowered from £35.00 to £19.50** 

International delivery (door to door delivery) is available for selected countries worldwide. Shipping will be automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection.
Please refer to our delivery page for more information.

Documents
Sil-Mid Limited DO NOT GUARANTEE that the information on this page is the most up to date information available from the manufacturer, there are times when updated information is released and we are not made aware immediately.